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SiC & GaN MMIC Foundry Services

Silicon Carbide (SiC) MESFETs and GaN-based HEMTs

Driver amp

For additional information, contact Cree at WirelessSales@cree.com.

Cree’s SiC MESFET and GaN HEMT MMIC processes are available for MMIC development using standard full-wafer (SFW) service or a shared multi-project (SMP) “pizza mask” fabrication service. Customers can design into the foundry using ADS or MWO design kits or have Cree perform the design service. Both processes feature

  • High power density (4-6 watts/mm) transistors
  • Slot vias
  • High reliability up to 175-225ºC operating channel temperatures
  • Scalable unit cells (1 to 8 mm/Cell)

The value of such MMICs is more power bandwidth and higher efficiency within a smaller footprint compared to other MMIC technologies.

Read the Foundry Services brochure.